Product Type 1

Our laser protection fluid series is a water-soluble solution designed for the wafer laser cutting process. A water-soluble protective fluid will be applied to the wafer surface to form a water-soluble protective film, which can effectively reduce the HAZ area during laser cutting and improve the yield of the laser cutting process.

产品类型1：介绍
激光保护液是为晶圆镭射切割制程而设计的水溶性保护液，涂布在晶圆表面能够形成一种水溶性保护膜，易清洗。
具有润滑、清洁的作用，使切割面平整光滑无毛刺。防喷溅，避免切割碎屑破坏晶圆表面。防腐蚀，耐高温，使晶圆在切割时减少碎裂、划痕，提高黏着力，快速带走切割时产生的颗粒物，提高产品切割良品率。